Messe SMT Hybrid Packaging Nurnberg

Messe SMT Hybrid Packaging Nurnberg

Messe SMT Hybrid Packaging Nurnberg

International Exhibition and Conference for System Integration in Micro Electronics

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Messe SMT Hybrid Packaging at Glance

Messe SMT Hybrid Packaging Nurnberg

International Exhibition and Conference for System Integration in Micro Electronics

The SMT Hybrid Packaging is the leading trade fair for the system integration in microelectronics since 1987.
Technologies and Processes, Materials and Components, Manufacturing, Manufacturing equipment, Reliability and Test, Software and Systems
and Service and Consulting: these are the key topics of the fair.
The highlights like Future Packaging, Hand Soldering Competition and Joint Stands beside a diverse, professional supporting program with panel discussions, product and company presentations add more value to the fair.
National and international companies from Asia, Europe and the US present their products from the following categories:

PCB production
Design and Development
Components
Packaging
Test Systems
Contract Manufacturing
Screen Printing
Soldering
EMS

The fair held in June 2017 with 420 exhibitors and 15,156 visitors in an area of 26,200 sqm.

The SMT 2018 will be held from 5 to 7, June, in Messe Nurnberg.

 SMT Hybrid Packaging 2018

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Resources
http://www.auma.de/en/Messedatenbank/Seiten/MesseDetailSeite.aspx?tf=156457&title=SMT%20Hybrid%20Packaging&goto=G
www.smthybridpackaging.de
www.smthybridpackaging.com

Exhibitors
419 (from 29 countries)
273 from Germany
146 from other countries

Visitors
15.156
10.761 from Germany
4.395 from other countries

Event location
Nuremberg, Germany
Messezentrum

Date
05.06.-07.06.2018
Juni 2019

Interval
every year

Founded in
1987

Organiser
Mesago Messe Frankfurt GmbH
Rotebühlstr. 83-85
70178 Stuttgart
Germany
Fon: +49 711 61946-0
Fax: +49 711 61946-91
info@mesago.com
www.mesago.de

Project team
Fon:+49 711 61946-256
Fax:+49 711 61946-93
smt@mesago.com
www.smthybridpackaging.de
www.smthybridpackaging.com

Industry sectors
Electrical Engineering, Electronics (industry 22)

Main product group
CAE, Chemical Bases, Electronic Packaging, Hybrid Circuits, Insertion Machines, Jointing Equipment, Measuring Equipment, Measuring Systems, Printed Circuit Boards, Printed Circuit Boards Production, Screen Printing, Semiconductor Production, Software, Soldering Apparatus, Surface Mount Technology, Testing Equipment, Testing Technology, Tools

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